A large number of integrated circuits are used in computer components, and high temperature is the enemy of integrated circuits. High temperatures can not only make system operation unstable, but also shorten its service life, even to burn down some components. The heat that causes high temperatures is not from outside of computer but the inside, or the inside of integrated circuit. The role of the heat sink is to absorb this heat, and then diverge into the chassis or outside the chassis to ensure the normal temperature of the computer components.
6063 T5 aluminum sheet
Computer heat sink mainly use 6063 T5 aluminum sheet of good quality, the purity of 6063 T5 aluminum sheet can reach more than 98%. 6063 T5 aluminum sheet has good heat conduction, small density, with a cheap price, so it has enjoy a high favor among people.
At present, copper and aluminum alloys are the commonly used material for heat sink, and each has its own advantages and disadvantages. Copper has good thermal conductivity, but the price is more expensive and the processing is more difficult, with small heat capacity, in addition, it is easily to oxidized. Aluminum alloys has low coats, light weight, etc. Some heat sink takes the advantages of both of copper and aluminum alloys, which embed a copper sheet on the base of the aluminum alloy heat sink, in general, the aluminum heat sink is sufficient to meets the cooling requirements for ordinary users.